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Block Diagram | Phase 1: Power Supply | Phase 2: Microcontroller circuit | Phase 3: Local osciallator Si570 |
Phase 4: G59 USB connection
| Phase 5: G59 Receiver assembly | Phase 6: G59 Input-Output HP-LP Filters |
Phase 7: Band pass filters and control logic | Phase 8: CW monitor | Phase 9: Transmitter circuits assembly |
Phase 10: Microphone preamplifier | Phase 11: Si570 Quasi oven circuit | Phase 12: G59 Receiver Image Calibrator | GBOX assembly
Phase 3: Local oscillator Si570

The phase 3 is assembly of a local oscillator, Si570. If the previously installed microprocessor (phase 2) can be described as 'brains' of Genesis G59, then the local oscillator is the 'heart' of G59 transceiver.

It is very important that special care is taken while assembling components in LO section, especially with orientation and soldering of Si570 and other SMT components.

The components installed in this phase are marked with letter G in suffix.

For the component values refer to component data sheet which is supplied with your kit.

In this phase you will be installing components outlined in red.


Component placement
Click Picture to Enlarge
Transceiver Interconnection


Click Picture to Enlarge
Transceiver Interconnection


The next step is to install Si570 circuit. Note the orientation of the IC and position of pin 1 (top left corner).

Do no overheat while soldering ! Do not apply any solder directly onto the pins of Si570. Instead heat up the pads on PCB board and apply small quantity of solder until it melts underneath the Si570 pins. If required remove protective solder mask layer (red protection film) from pads 7 and 8.
Make sure that Si570 is positioned exactly in the centre of PCB layout.

Transceiver Interconnection


Install SMT capacitors C5G, C18G and C19G.

Transceiver Interconnection


Installation of IC3G
Note the position of IC3G in relation to pads of two other SMT integral circuits (bottom layer).


Transceiver Interconnection


Align the IC3G over pads and position the pin index mark to the top. Solder it with minimum heat required to reflow solder between pin pins and pads.

Transceiver Interconnection


Installation of capacitor C16G (through hole) and C17G (SMT)
Note: Follow the instructions of installations of above capacitors exactly as described below.

Locate the holes for C16G on the top of the PCB.

Transceiver Interconnection


Solder C16G leads carefully using minimal amount of solder.
Do not run the solder onto square SMT pads.
Cut off the leads as close to PCB as practically possible.


Transceiver Interconnection


Position the C17G over the square pads and solder.

Transceiver Interconnection


Installation of IC2G
Locate the position of integral circuit IC2G (bottom layer).

Transceiver Interconnection


Position the IC2G over the pads as shown on photo below.
Note that IN pin is marked with white dot and has pointed lead.

Transceiver Interconnection


Install SMT capacitor C12G (bottom layer).

Transceiver Interconnection



Install inductors L1G and L2G.
Install resistors R1G to R11G.

Transceiver Interconnection


Install resistors R12G to R19G.

Transceiver Interconnection



Install capacitors C1G, C2G, C3G, C4G, C6G, C8G, C9G.
Install transistors TR1G and TR2G.


Transceiver Interconnection


Install electrolytic capacitors C13G and C15G (C15G capacitor is not shown on the photo, it is located above resistor R12G).

Install capacitor C11G.

Note: capacitor C11G connects output of IC2G to input of IC3G.

Transceiver Interconnection


Install resistors R8N and R7N which are located at top middle part of PCB close IC3S power supply section.
Resistors R8N and R7N provide +12V to IC2G. If you fail to install them you will have no power on amplifier IC2G !

Transceiver Interconnection


Another detailed photo showing the positioning of capacitors.

Transceiver Interconnection


This final photo shows all of the components installed during this phase.

Transceiver Interconnection


This completes assembly of phase 3.



Voltage and frequency check

1. Connect 12V DC power supply to plug DC1S.
Note: Do not connect USB cable yet !

2. Check voltages on the following pins of IC1G (Si570).



pin voltage [V]
1 0
2 3.27
3 0
4 1.16
5 1.16
6 3.19
7 0 or 3.25, either value is fine.
8 0 or 3.25, either value is fine.


Si570 current consumption

Measure the voltage over resistor R5G. It should read approximately 83mV which correspond to current consumption of 83mA.




LO frequency check

Upon the power up the Si570 will oscillate at a default frequency of 56.320 MHz.
Connect frequency counter to pin 4 and 5 to check the LO frequency.




IC2G amplifier voltage check

Check voltage of IC2G (IN +2.84V and OUT +4.38V)




IC3G divider: output voltage check

Check voltage on resistors R12G to R19G. The output voltage should be +1.65V.

Transceiver Interconnection



IC3G divider: output freqency check

Connect the frequency counter to resistors R12G to R19G. The frequency output should read 14.080 MHz.



Next phase: G59 USB connection to GSDR software


Block Diagram | Phase 1: Power Supply | Phase 2: Microcontroller circuit | Phase 3: Local osciallator Si570 |
Phase 4: G59 USB connection
| Phase 5: G59 Receiver assembly | Phase 6: G59 Input-Output HP-LP Filters |
Phase 7: Band pass filters and control logic | Phase 8: CW monitor | Phase 9: Transmitter circuits assembly |
Phase 10: Microphone preamplifier | Phase 11: Si570 Quasi oven circuit | Phase 12: G59 Receiver Image Calibrator | GBOX assembly

Need help? email: info@GenesisRadio.com.au


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